Assignee
HIRANO YOSHIKAZU
JP·2 granted patents·7 citations·filing 2008–2011
Top patents by PatentIndex Score
2 records- 0171US8338715B2PCB with soldering pad projections forming fillet solder joints and method of production thereofHIRANO YOSHIKAZU·Filed 2008·Granted Dec 25, 2012·7 cites·7 claims
- 0243US8701488B2Electronic component analyzing apparatus and methodHIRANO YOSHIKAZU·Filed 2011·Granted Apr 22, 2014·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when HIRANO YOSHIKAZU files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →