Assignee
HIRATA ICHIRO
JP·3 granted patents·9 citations·filing 2007–2009
Top patents by PatentIndex Score
3 records- 0178US8229712B2Analysis method using finite element method, program causing computer to execute same, and system for sameHIRATA ICHIRO·Filed 2009·Granted Jul 24, 2012·8 cites·6 claims
- 0259US8392167B2Three-dimensional board warp analysis system, three-dimensional board warp analysis device, three-dimensional board warp analysis method and programHIRATA ICHIRO·Filed 2008·Granted Mar 5, 2013·1 cites·20 claims
- 0346US8280649B2Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing programHIRATA ICHIRO·Filed 2007·Granted Oct 2, 2012·0 cites·48 claims
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