Assignee
HIROTSURU HIDEKI
JP·6 granted patents·11 citations·filing 2009–2012
Top patents by PatentIndex Score
6 records- 0173US8890189B2Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the waferHIROTSURU HIDEKI·Filed 2010·Granted Nov 18, 2014·2 cites·19 claims
- 0270US8883564B2Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent memberHIROTSURU HIDEKI·Filed 2010·Granted Nov 11, 2014·4 cites·10 claims
- 0368US8322398B2Manufacturing method of aluminum-diamond compositeHIROTSURU HIDEKI·Filed 2009·Granted Dec 4, 2012·4 cites·7 claims
- 0458US9017824B2Aluminum-diamond composite and manufacturing methodHIROTSURU HIDEKI·Filed 2009·Granted Apr 28, 2015·1 cites·10 claims
- 0546US9387532B2Composite substrate for LED light emitting element, method of production of same, and LED light emitting elementHIROTSURU HIDEKI·Filed 2010·Granted Jul 12, 2016·0 cites·13 claims
- 0643US9524918B2Heat dissipating component for semiconductor elementHIROTSURU HIDEKI·Filed 2012·Granted Dec 20, 2016·0 cites·9 claims
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