Assignee
HISADA WATARU
JP·1 granted patent·1 pending application·4 citations·filing 2004–2008
Top patents by PatentIndex Score
2 records- 0146US8061217B2Apparatus for measuring a flow rate of a powderHISADA WATARU·Filed 2008·Granted Nov 22, 2011·4 cites·5 claims
- 0237US2009013904A1Method for manufacturing a solid plating material and the solid plating material manufactured by the methodHISADA WATARU·Filed 2004·Application pending·0 cites
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