Assignee
HISHA YUKI
JP·3 granted patents·4 citations·filing 2008–2009
Top patents by PatentIndex Score
3 records- 0171US8067500B2Curable composition, bonding method and assemblyHISHA YUKI·Filed 2008·Granted Nov 29, 2011·3 cites·20 claims
- 0261US8273827B2Adhesive composition and adhesion methodHISHA YUKI·Filed 2009·Granted Sep 25, 2012·1 cites·20 claims
- 0354US8323448B2Adhesive composition and bonding methodHISHA YUKI·Filed 2008·Granted Dec 4, 2012·0 cites·14 claims
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