Assignee

HONG JONG WAN

KR·2 granted patents·2 citations·filing 2008–2008

Technology mixC09J2 H10P2 H10W2 Y10T2 C08L1

Top patents by PatentIndex Score

2 records

0157US8541289B2Dicing die bonding film and dicing methodHONG JONG WAN·Filed 2008·Granted Sep 24, 2013·1 cites·11 claims
0254US8207616B2Adhesive film, dicing die bonding film and semiconductor device using the sameHONG JONG WAN·Filed 2008·Granted Jun 26, 2012·1 cites·20 claims

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