Assignee
HONJO HIROSHI
JP·1 granted patent·2 pending applications·4 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0169US8508048B2Semiconductor device utilizing a package on package structure and manufacturing method thereofHONJO HIROSHI·Filed 2011·Granted Aug 13, 2013·4 cites·4 claims
- 0240US2014046084A1Siloxane Compound and Cured Product ThereofHONJO HIROSHI·Filed 2012·Application pending·0 cites
- 0335US2014046014A1Siloxane compound and cured product thereofHONJO HIROSHI·Filed 2012·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →