Assignee
HORIKAWA YUHEI
JP·2 granted patents·3 citations·filing 2011–2011
Top patents by PatentIndex Score
2 records- 0168US8692127B2Terminal structure, printed wiring board, module substrate, and electronic deviceHORIKAWA YUHEI·Filed 2011·Granted Apr 8, 2014·3 cites·6 claims
- 0239US8816213B2Terminal structure, printed wiring board, module substrate, and electronic deviceHORIKAWA YUHEI·Filed 2011·Granted Aug 26, 2014·0 cites·7 claims
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