Assignee
HOTTA TERUYUKI
JP·3 granted patents·8 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0187US8197583B2Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit boardHOTTA TERUYUKI·Filed 2011·Granted Jun 12, 2012·4 cites·4 claims
- 0265US8137447B2Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit boardHOTTA TERUYUKI·Filed 2009·Granted Mar 20, 2012·0 cites·8 claims
- 0363US8276270B2Method for manufacturing printed circuit boardHOTTA TERUYUKI·Filed 2008·Granted Oct 2, 2012·4 cites·2 claims
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