Assignee
HSIAO WEI-MIN
TW·2 granted patents·1 pending application·7 citations·filing 2005–2012
Top patents by PatentIndex Score
3 records- 0169US8194896B2Packaging structure and method of a MEMS microphoneHSIAO WEI-MIN·Filed 2008·Granted Jun 5, 2012·5 cites·18 claims
- 0264US8975157B2Carrier bonding and detaching processes for a semiconductor waferHSIAO WEI-MIN·Filed 2012·Granted Mar 10, 2015·2 cites·12 claims
- 0338US2006255253A1Method for packaging an image sensor die and a package thereofHSIAO WEI-MIN·Filed 2005·Application pending·0 cites
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