Assignee
HSIEH CHENG-CHIEH
TW·4 granted patents·15 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0185US8604619B2Through silicon via keep out zone formation along different crystal orientationsHSIEH CHENG-CHIEH·Filed 2011·Granted Dec 10, 2013·6 cites·19 claims
- 0280US9034695B2Integrated thermal solutions for packaging integrated circuitsHSIEH CHENG-CHIEH·Filed 2012·Granted May 19, 2015·5 cites·20 claims
- 0372US9337123B2Thermal structure for integrated circuit packageHSIEH CHENG-CHIEH·Filed 2012·Granted May 10, 2016·3 cites·18 claims
- 0460US9391000B2Methods for forming silicon-based hermetic thermal solutionsHSIEH CHENG-CHIEH·Filed 2012·Granted Jul 12, 2016·1 cites·20 claims
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