Assignee
HSIO TECH LLC
US·13 granted patents·42 citations·filing 2013–2017
Top patents by PatentIndex Score
13 records- 0194US9761520B2Method of making an electrical connector having electrodeposited terminalsHSIO TECH LLC·Filed 2016·Granted Sep 12, 2017·10 cites·13 claims
- 0289US9689897B2Performance enhanced semiconductor socketHSIO TECH LLC·Filed 2014·Granted Jun 27, 2017·13 cites·19 claims
- 0384US9559447B2Mechanical contact retention within an electrical connectorHSIO TECH LLC·Filed 2016·Granted Jan 31, 2017·3 cites·13 claims
- 0483US9755335B2Low profile electrical interconnect with fusion bonded contact retention and solder wick reductionHSIO TECH LLC·Filed 2016·Granted Sep 5, 2017·3 cites·19 claims
- 0577US10159154B2Fusion bonded liquid crystal polymer circuit structureHSIO TECH LLC·Filed 2015·Granted Dec 18, 2018·3 cites·18 claims
- 0677US9660368B2High performance surface mount electrical interconnectHSIO TECH LLC·Filed 2015·Granted May 23, 2017·3 cites·17 claims
- 0776US10667410B2Method of making a fusion bonded circuit structureHSIO TECH LLC·Filed 2017·Granted May 26, 2020·2 cites·19 claims
- 0873US9699906B2Hybrid printed circuit assembly with low density main core and embedded high density circuit regionsHSIO TECH LLC·Filed 2013·Granted Jul 4, 2017·3 cites·11 claims
- 0966US9536815B2Semiconductor socket with direct selective metalizationHSIO TECH LLC·Filed 2013·Granted Jan 3, 2017·2 cites·12 claims
- 1056US10609819B2Hybrid printed circuit assembly with low density main core and embedded high density circuit regionsHSIO TECH LLC·Filed 2017·Granted Mar 31, 2020·0 cites·11 claims
- 1151US10453789B2Electrodeposited contact terminal for use as an electrical connector or semiconductor packaging substrateHSIO TECH LLC·Filed 2017·Granted Oct 22, 2019·0 cites·20 claims
- 1239US9930775B2Copper pillar full metal via electrical circuit structureHSIO TECH LLC·Filed 2014·Granted Mar 27, 2018·0 cites·16 claims
- 1337US10506722B2Fusion bonded liquid crystal polymer electrical circuit structureHSIO TECH LLC·Filed 2016·Granted Dec 10, 2019·0 cites·16 claims
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