Assignee
HSU JUN-CHUNG
TW·1 granted patent·4 pending applications·3 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0161US8315063B2Solder pad structure with high bondability to solder ballHSU JUN-CHUNG·Filed 2009·Granted Nov 20, 2012·3 cites·5 claims
- 0243US2011061234A1Method For Fabricating Carrier Board Having No Conduction LineHSU JUN-CHUNG·Filed 2009·Application pending·0 cites
- 0340US2011049703A1Flip-Chip Package StructureHSU JUN-CHUNG·Filed 2009·Application pending·0 cites
- 0437US2013255858A1Method of manufacturing a laminate circuit boardHSU JUN-CHUNG·Filed 2012·Application pending·0 cites
- 0537US2013284500A1Laminate circuit board structureHSU JUN-CHUNG·Filed 2012·Application pending·0 cites
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