Assignee
HU CHIH LIANG
TW·5 granted patents·0 citations·filing 2015–2019
Top patents by PatentIndex Score
5 records- 0148US10600703B2Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereofHU CHIH LIANG·Filed 2019·Granted Mar 24, 2020·0 cites·1 claims
- 0243US10256116B2Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereofHU CHIH LIANG·Filed 2017·Granted Apr 9, 2019·0 cites·5 claims
- 0330US9515047B2High performance package and process for makingHU CHIH-LIANG·Filed 2015·Granted Dec 6, 2016·0 cites·9 claims
- 0428US9735138B2Integrated circuit package and method of making the sameHU CHIH-LIANG·Filed 2015·Granted Aug 15, 2017·0 cites·3 claims
- 0527US11521862B2Process for fabricating circuit components in matrix batchesHU CHIH LIANG·Filed 2018·Granted Dec 6, 2022·0 cites·18 claims
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