Assignee
HU KEVIN KUNZHONG
US·2 granted patents·1 pending application·5 citations·filing 2011–2011
Top patents by PatentIndex Score
3 records- 0169US9564391B2Thermal enhanced package using embedded substrateHU KEVIN (KUNZHONG)·Filed 2011·Granted Feb 7, 2017·3 cites·20 claims
- 0269US8592259B2Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layerHU KEVIN KUNZHONG·Filed 2011·Granted Nov 26, 2013·2 cites·20 claims
- 0348US2013154106A1Stacked Packaging Using Reconstituted WafersHU KEVIN KUNZHONG·Filed 2011·Application pending·0 cites
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