Assignee

HU LEJUN

US·2 granted patents·55 citations·filing 2011–2013

Technology mixH10D2 H10F2 H10W2

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2 records

0195US8441104B1Electrical overstress protection using through-silicon-via (TSV)HU LEJUN·Filed 2011·Granted May 14, 2013·52 cites·20 claims
0273US8525299B2Electrical overstress protection using through-silicon-via (TSV)HU LEJUN·Filed 2013·Granted Sep 3, 2013·3 cites·17 claims

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