Assignee
HU YEN-CHANG
TW·3 granted patents·1 pending application·63 citations·filing 2012–2012
Top patents by PatentIndex Score
4 records- 0197US8922005B2Methods and apparatus for package on package devices with reversed stud bump through via interconnectionsHU YEN-CHANG·Filed 2012·Granted Dec 30, 2014·62 cites·18 claims
- 0261US8866285B2Fan-out package comprising bulk metalHU YEN-CHANG·Filed 2012·Granted Oct 21, 2014·1 cites·19 claims
- 0354US8816507B2Package-on-Package structures having buffer dams and method for forming the sameHU YEN-CHANG·Filed 2012·Granted Aug 26, 2014·0 cites·16 claims
- 0440US2014042152A1Variable frequency microwave device and method for rectifying wafer warpageHU YEN-CHANG·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →