Assignee
HUA CHANG-HWANG
TW·1 granted patent·2 pending applications·7 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0178US8497206B2Method of processing backside copper layer for semiconductor chipsHUA CHANG-HWANG·Filed 2010·Granted Jul 30, 2013·7 cites·22 claims
- 0235US2013099250A1Structure of semiconductor chips with enhanced die strength and a fabrication method thereofHUA CHANG-HWANG·Filed 2012·Application pending·0 cites
- 0334US2013207266A1Copper Interconnect for III-V Compound Semiconductor DevicesHUA CHANG-HWANG·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →