Assignee
HUANG CHENG-TANG
TW·2 granted patents·2 pending applications·2 citations·filing 2008–2011
Top patents by PatentIndex Score
4 records- 0161US8211789B2Manufacturing method of a bump structure having a reinforcement memberHUANG CHENG-TANG·Filed 2011·Granted Jul 3, 2012·2 cites·5 claims
- 0244US2009302465A1Die rearrangement package structure and method thereofHUANG CHENG-TANG·Filed 2008·Application pending·0 cites
- 0338US2011003431A1Method of die rearrangement package structure having patterned under bump metallurgic layer connecting metal leadHUANG CHENG-TANG·Filed 2010·Application pending·0 cites
- 0435US8274150B2Chip bump structure and method for forming the sameHUANG CHENG TANG·Filed 2011·Granted Sep 25, 2012·0 cites·12 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →