Assignee
HUANG CHI-MING
TW·1 granted patent·2 pending applications·3 citations·filing 2011–2016
Top patents by PatentIndex Score
3 records- 0167US8691629B2Packaging jig and process for semiconductor packagingHUANG CHI-MING·Filed 2011·Granted Apr 8, 2014·3 cites·22 claims
- 0238US2014327635A1Touch electronic deviceHUANG CHI-MING·Filed 2014·Application pending·0 cites
- 0333US2017357241A1System, method, and devices for reducing concussive traumatic brain injuriesHUANG CHI-MING·Filed 2016·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →