Assignee
HUANG CHUNG-ER
TW·4 granted patents·16 pending applications·12 citations·filing 2007–2011
Top patents by PatentIndex Score
20 records- 0176US8059425B2Integrated circuit module with temperature compensation crystal oscillatorHUANG CHUNG-ER·Filed 2008·Granted Nov 15, 2011·7 cites·12 claims
- 0267US8874061B2Filtering apparatus and method for dual-band sensing circuitHUANG CHUNG-ER·Filed 2008·Granted Oct 28, 2014·5 cites·12 claims
- 0348US2010009501A1Packaging structure, method for manufacturing the same, and method for using the sameHUANG CHUNG-ER·Filed 2009·Application pending·0 cites
- 0447US2010052143A1Electronic packaging structure and a manufacturing method thereofHUANG CHUNG-ER·Filed 2009·Application pending·0 cites
- 0546US2010055840A1Electronic packaging structure and a manufacturing method thereofHUANG CHUNG-ER·Filed 2008·Application pending·0 cites
- 0646US2009091907A1Shielding structure for electronic componentsHUANG CHUNG-ER·Filed 2007·Application pending·0 cites
- 0745US8749038B2Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereofHUANG CHUNG-ER·Filed 2008·Granted Jun 10, 2014·0 cites·9 claims
- 0845US2009179327A1Packaging structure, method for manufacturing the same, and method for using the sameHUANG CHUNG-ER·Filed 2008·Application pending·0 cites
- 0943US8242381B2Chip-level through hole structure of electronic packageHUANG CHUNG-ER·Filed 2007·Granted Aug 14, 2012·0 cites·6 claims
- 1043US2009065905A1Conductive metal structure applied to a module IC and method of manufacturing the sameHUANG CHUNG-ER·Filed 2008·Application pending·0 cites
- 1142US2009137217A1Communication transmission system and power detection method thereofHUANG CHUNG-ER·Filed 2007·Application pending·0 cites
- 1238US2009111405A1Signal matching module for single or multiple systemsHUANG CHUNG-ER·Filed 2007·Application pending·0 cites
- 1338US2009091005A1Shielding structure for semiconductors and manufacturing method thereforHUANG CHUNG-ER·Filed 2007·Application pending·0 cites
- 1438US2009174618A1RF module integrated with active antennaHUANG CHUNG-ER·Filed 2008·Application pending·0 cites
- 1535US2009051044A1Wafer-level packaged structure and method for making the sameHUANG CHUNG-ER·Filed 2007·Application pending·0 cites
- 1633US2012139089A1Module ic package structure and method for making the sameHUANG CHUNG-ER·Filed 2011·Application pending·0 cites
- 1732US2011304379A1Signal matching module with combination of electronic components for signal matching of single or multiple subsystemsHUANG CHUNG ER·Filed 2011·Application pending·0 cites
- 1829US2013113089A1Module ic package structure having a metal shielding function for preventing electrical malfunction induced by short-circuitHUANG CHUNG-ER·Filed 2011·Application pending·0 cites
- 1928US2012162930A1Module ic package structure with electrical shield function and method for making the sameHUANG CHUNG-ER·Filed 2010·Application pending·0 cites
- 2028US2012211876A1Module ic package structureHUANG CHUNG-ER·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →