Assignee
HUANG MIN-LUNG
TW·1 granted patent·3 pending applications·9 citations·filing 2005–2009
Top patents by PatentIndex Score
4 records- 0178US8288853B2Three-dimensional package and method of making the sameHUANG MIN-LUNG·Filed 2009·Granted Oct 16, 2012·9 cites·10 claims
- 0243US2010224983A1Semiconductor package structure and manufacturing method thereofHUANG MIN-LUNG·Filed 2009·Application pending·0 cites
- 0338US2006276023A1Method for forming bumpsHUANG MIN-LUNG·Filed 2006·Application pending·0 cites
- 0436US2005215044A1Method for forming photoresist layer on subsrtate and bumping process using the sameHUANG MIN-LUNG·Filed 2005·Application pending·0 cites
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