Assignee
HUANG SHIH-FU
TW·2 granted patents·1 pending application·15 citations·filing 2010–2017
Top patents by PatentIndex Score
3 records- 0189US8288869B2Semiconductor package with substrate having single metal layer and manufacturing methods thereofHUANG SHIH-FU·Filed 2010·Granted Oct 16, 2012·15 cites·20 claims
- 0242US10288258B1Lighting moduleHUANG SHIH FU·Filed 2017·Granted May 14, 2019·0 cites·8 claims
- 0335US2010289132A1Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and packageHUANG SHIH-FU·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →