Assignee
HUANG TSE-YAO
TW·4 granted patents·3 citations·filing 2011–2011
Top patents by PatentIndex Score
4 records- 0166US8476764B2Bonding pad structure for semiconductor devicesHUANG TSE-YAO·Filed 2011·Granted Jul 2, 2013·2 cites·9 claims
- 0263US8470515B2Method of forming an etch maskHUANG TSE-YAO·Filed 2011·Granted Jun 25, 2013·1 cites·8 claims
- 0351US8963282B2Crack stop structure and method for forming the sameHUANG TSE-YAO·Filed 2011·Granted Feb 24, 2015·0 cites·10 claims
- 0448US8692245B2Crack stop structure and method for forming the sameHUANG TSE-YAO·Filed 2011·Granted Apr 8, 2014·0 cites·11 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →