Assignee
HUANG YU-LUNG
TW·3 granted patents·10 citations·filing 2011–2011
Top patents by PatentIndex Score
3 records- 0181US8890268B2Chip package and fabrication method thereofHUANG YU-LUNG·Filed 2011·Granted Nov 18, 2014·5 cites·16 claims
- 0279US8692358B2Image sensor chip package and method for forming the sameHUANG YU-LUNG·Filed 2011·Granted Apr 8, 2014·5 cites·8 claims
- 0349US8508028B2Chip package and method for forming the sameHUANG YU-LUNG·Filed 2011·Granted Aug 13, 2013·0 cites·12 claims
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