Assignee
HUANG YU WEI
TW·1 granted patent·2 pending applications·0 citations·filing 2011–2018
Top patents by PatentIndex Score
3 records- 0134US8618672B2Three dimensional stacked chip package structureHUANG YU-WEI·Filed 2011·Granted Dec 31, 2013·0 cites·12 claims
- 0234US2019106936A1Rebound Device Used In Running A Pull CordHUANG YU WEI·Filed 2018·Application pending·0 cites
- 0329US2016210766A1Method for displaying text and graph messageHUANG YU-WEI·Filed 2015·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →