Assignee
HUATIAN TECH KUNSHAN ELECT CO LTD
CN·2 granted patents·2 pending applications·9 citations·filing 2017–2022
Top patents by PatentIndex Score
4 records- 0182US10559525B2Embedded silicon substrate fan-out type 3D packaging structureHUATIAN TECH KUNSHAN ELECT CO LTD·Filed 2018·Granted Feb 11, 2020·9 cites·15 claims
- 0239US12506119B2System-on-chip integrated packaging structure, having a chip embedded in a recess, manufacturing method therefor and three-dimensional stacked deviceHUATIAN TECH KUNSHAN ELECT CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·12 claims
- 0331US2018138221A1Wafer level packaging structure of high-pixel image sensor chipHUATIAN TECH KUNSHAN ELECT CO LTD·Filed 2017·Application pending·0 cites
- 0429US2018182727A1Embedded silicon substrate fan-out type packaging structure and manufacturing method thereforHUATIAN TECH KUNSHAN ELECT CO LTD·Filed 2018·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →