Assignee
HUBEI DINGHUI MICROELECTRONICS MAT CO LTD
CN·2 granted patents·2 citations·filing 2018–2018
Top patents by PatentIndex Score
2 records- 0166US11179822B2Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing materialHUBEI DINGHUI MICROELECTRONICS MAT CO LTD·Filed 2018·Granted Nov 23, 2021·2 cites·15 claims
- 0240US10967481B2CMP layer based on porous cerium oxide and preparation method thereofHUBEI DINGHUI MICROELECTRONICS MAT CO LTD·Filed 2018·Granted Apr 6, 2021·0 cites·3 claims
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