Assignee

HUNG KIN YIK

HK·1 granted patent·2 citations·filing 2012–2012

Technology mixB32B1 H01L1 H10W1

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0156US9281290B2Bond head for thermal compression die bondingHUNG KIN YIK·Filed 2012·Granted Mar 8, 2016·2 cites·13 claims

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