Assignee
HUZHOU JIANWENLU TECH CO LTD
CN·2 granted patents·1 citations·filing 2020–2020
Top patents by PatentIndex Score
2 records- 0173US11770920B2EMI shielding material, EMI shielding process, and communication module productHUZHOU JIANWENLU TECH CO LTD·Filed 2020·Granted Sep 26, 2023·1 cites·17 claims
- 0241US11552028B2Chip packaging method and chip packaging structureHUZHOU JIANWENLU TECH CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when HUZHOU JIANWENLU TECH CO LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →