Assignee
HWANG CHIEN LING
TW·15 granted patents·1 pending application·166 citations·filing 2010–2012
Top patents by PatentIndex Score
16 records- 0196US9018758B2Cu pillar bump with non-metal sidewall spacer and metal top capHWANG CHIEN LING·Filed 2010·Granted Apr 28, 2015·28 cites·20 claims
- 0296US8258055B2Method of forming semiconductor dieHWANG CHIEN LING·Filed 2010·Granted Sep 4, 2012·38 cites·16 claims
- 0396US8104666B1Thermal compressive bonding with separate die-attach and reflow processesHWANG CHIEN LING·Filed 2010·Granted Jan 31, 2012·29 cites·18 claims
- 0495US8317077B2Thermal compressive bonding with separate die-attach and reflow processesHWANG CHIEN LING·Filed 2012·Granted Nov 27, 2012·22 cites·15 claims
- 0591US9048135B2Copper pillar bump with cobalt-containing sidewall protectionHWANG CHIEN LING·Filed 2011·Granted Jun 2, 2015·12 cites·21 claims
- 0688US8841766B2Cu pillar bump with non-metal sidewall protection structureHWANG CHIEN LING·Filed 2010·Granted Sep 23, 2014·8 cites·20 claims
- 0786US8569887B2Post passivation interconnect with oxidation prevention layerHWANG CHIEN LING·Filed 2010·Granted Oct 29, 2013·8 cites·20 claims
- 0885US8177862B2Thermal compressive bond headHWANG CHIEN LING·Filed 2010·Granted May 15, 2012·7 cites·15 claims
- 0983US8546802B2Pick-and-place tool for packaging processHWANG CHIEN LING·Filed 2011·Granted Oct 1, 2013·6 cites·20 claims
- 1070US9021682B2Apparatus for stud bump formationHWANG CHIEN LING·Filed 2012·Granted May 5, 2015·2 cites·19 claims
- 1169US9524945B2Cu pillar bump with L-shaped non-metal sidewall protection structureHWANG CHIEN LING·Filed 2010·Granted Dec 20, 2016·2 cites·20 claims
- 1269US8940618B2Method and device for cutting semiconductor wafersHWANG CHIEN LING·Filed 2012·Granted Jan 27, 2015·2 cites·20 claims
- 1366US8587119B2Conductive feature for semiconductor substrate and method of manufactureHWANG CHIEN-LING·Filed 2010·Granted Nov 19, 2013·2 cites·20 claims
- 1451US8834662B2Apparatus and method of separating wafer from carrierHWANG CHIEN LING·Filed 2012·Granted Sep 16, 2014·0 cites·20 claims
- 1549US8679591B2Method for reducing voids in a copper-tin interface and structure formed therebyHWANG CHIEN LING·Filed 2010·Granted Mar 25, 2014·0 cites·20 claims
- 1640US2013273717A1Apparatus and Method for the Singulation of a Semiconductor WaferHWANG CHIEN LING·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →