Assignee
HWANG MI-SUN
KR·3 granted patents·1 pending application·2 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0159US8881381B2Method of manufacturing printed circuit boardHWANG MI SUN·Filed 2009·Granted Nov 11, 2014·2 cites·6 claims
- 0256US8541096B2Printed circuit board and method of manufacturing the sameHWANG MI SUN·Filed 2009·Granted Sep 24, 2013·0 cites·7 claims
- 0346US2012225521A1Board on chip package substrate and manufacturing method thereofHWANG MI-SUN·Filed 2012·Application pending·0 cites
- 0437US8415200B2Method for manufacturing semiconductor packageHWANG MI SUN·Filed 2011·Granted Apr 9, 2013·0 cites·17 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →