Assignee
HWANG SUN-HA
KR·2 granted patents·3 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0161US8424195B2Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the sameHWANG SUN HA·Filed 2009·Granted Apr 23, 2013·3 cites·20 claims
- 0242US8497570B2Wafer, fabricating method of the same, and semiconductor substrateHWANG SUN-HA·Filed 2011·Granted Jul 30, 2013·0 cites·18 claims
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