Assignee
HWANG TAE-JOO
KR·4 granted patents·12 citations·filing 2010–2016
Top patents by PatentIndex Score
4 records- 0187US8421244B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2010·Granted Apr 16, 2013·7 cites·32 claims
- 0278US9484292B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2014·Granted Nov 1, 2016·3 cites·15 claims
- 0369US9685400B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2016·Granted Jun 20, 2017·1 cites·20 claims
- 0462US8129221B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2011·Granted Mar 6, 2012·1 cites·10 claims
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