Assignee

HYBOND INC

US·2 granted patents·156 citations·filing 1988–1988

Technology mixB23K1 G01L1 H10P1 Y10T1

Top patents by PatentIndex Score

2 records

0194US4884223ADynamic force measurement systemHYBOND INC·Filed 1988·Granted Nov 28, 1989·148 cites·14 claims
0222US4857133AMethod and apparatus for bonding with consistent uniform bond thicknessHYBOND INC·Filed 1988·Granted Aug 15, 1989·8 cites·2 claims

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