Assignee
IBIDEN CO LTD
JP·1,055 granted patents·552 pending applications·17,483 citations·filing 1981–2025
Top patents by PatentIndex Score
1,607 records- 0199US7396586B2Pore forming material for porous body, manufacturing method of pore forming material for porous body, manufacturing method of porous body, porous body, and honeycomb structural bodyIBIDEN CO LTD·Filed 2005·Granted Jul 8, 2008·108 cites·19 claims
- 0299US7307852B2Printed circuit board and method for manufacturing printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Dec 11, 2007·82 cites·21 claims
- 0399US6876554B1Printing wiring board and method of producing the same and capacitor to be contained in printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Apr 5, 2005·160 cites·4 claims
- 0499US6828510B1Multilayer printed wiring board and method of manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 2000·Granted Dec 7, 2004·176 cites·21 claims
- 0599US6724638B1Printed wiring board and method of producing the sameIBIDEN CO LTD·Filed 2000·Granted Apr 20, 2004·249 cites·10 claims
- 0699US6534723B1Multilayer printed-circuit board and semiconductor deviceIBIDEN CO LTD·Filed 2000·Granted Mar 18, 2003·316 cites·28 claims
- 0798US11298686B2Honeycomb catalytic converterIBIDEN CO LTD·Filed 2020·Granted Apr 12, 2022·8 cites·17 claims
- 0898US11298685B2Honeycomb catalytic converterIBIDEN CO LTD·Filed 2020·Granted Apr 12, 2022·8 cites·17 claims
- 0998US8971053B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Mar 3, 2015·62 cites·20 claims
- 1098US7978478B2Printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Jul 12, 2011·46 cites·8 claims
- 1198US7852634B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Dec 14, 2010·55 cites·15 claims
- 1298US7842887B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Nov 30, 2010·45 cites·36 claims
- 1398US7622183B2Multilayer printed wiring board with filled viahole structureIBIDEN CO LTD·Filed 2006·Granted Nov 24, 2009·52 cites·38 claims
- 1498US7524350B2Ceramic honeycomb structural bodyIBIDEN CO LTD·Filed 2007·Granted Apr 28, 2009·50 cites·20 claims
- 1598US7473465B2Honeycomb structure, porous body, pore forming material for the porous body, and methods for manufacturing the pore forming material, the porous body and the honeycomb structureIBIDEN CO LTD·Filed 2006·Granted Jan 6, 2009·89 cites·26 claims
- 1698US7462216B2Honeycomb unit and honeycomb structureIBIDEN CO LTD·Filed 2007·Granted Dec 9, 2008·56 cites·23 claims
- 1798US7449427B2Honeycomb structured bodyIBIDEN CO LTD·Filed 2006·Granted Nov 11, 2008·78 cites·14 claims
- 1898US7427309B2Honeycomb filter and ceramic filter assemblyIBIDEN CO LTD·Filed 2005·Granted Sep 23, 2008·119 cites·47 claims
- 1998US7387829B2Honeycomb structure, porous body, pore forming material for the porous body, and methods for manufacturing the pore forming material, the porous body and the honeycomb structureIBIDEN CO LTD·Filed 2005·Granted Jun 17, 2008·82 cites·18 claims
- 2098US7348049B2Honeycomb structural body, manufacturing method of the honeycomb structural body, and exhaust gas purifying deviceIBIDEN CO LTD·Filed 2005·Granted Mar 25, 2008·95 cites·53 claims
- 2198US7112233B2Honeycomb filter and ceramic filter assemblyIBIDEN CO LTD·Filed 2003·Granted Sep 26, 2006·178 cites·41 claims
- 2298US6909054B2Multilayer printed wiring board and method for producing multilayer printed wiring boardIBIDEN CO LTD·Filed 2001·Granted Jun 21, 2005·131 cites·7 claims
- 2398US6770116B2Regeneration device of exhaust gas purification filter and filter regeneration methodIBIDEN CO LTD·Filed 2001·Granted Aug 3, 2004·119 cites·11 claims
- 2498US6669751B1Honeycomb filter and ceramic filter assemblyIBIDEN CO LTD·Filed 2000·Granted Dec 30, 2003·399 cites·14 claims
- 2598US6228466B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted May 8, 2001·238 cites·20 claims
- 2698US5055321AAdhesive for electroless plating, printed circuit boards and method of producing the sameIBIDEN CO LTD·Filed 1989·Granted Oct 8, 1991·152 cites·8 claims
- 2797US11618009B2Honeycomb catalytic converterIBIDEN CO LTD·Filed 2020·Granted Apr 4, 2023·7 cites·7 claims
- 2897US11298687B2Honeycomb catalytic converterIBIDEN CO LTD·Filed 2020·Granted Apr 12, 2022·6 cites·18 claims
- 2997US10989092B2Honeycomb structured bodyIBIDEN CO LTD·Filed 2020·Granted Apr 27, 2021·6 cites·4 claims
- 3097US7691189B2Printed wiring board and its manufacturing methodIBIDEN CO LTD·Filed 2007·Granted Apr 6, 2010·57 cites·18 claims
- 3197US7589394B2InterposerIBIDEN CO LTD·Filed 2008·Granted Sep 15, 2009·90 cites·22 claims
- 3297US7556666B2Honeycomb structureIBIDEN CO LTD·Filed 2006·Granted Jul 7, 2009·34 cites·25 claims
- 3397US7462784B2Heat resistant substrate incorporated circuit wiring boardIBIDEN CO LTD·Filed 2006·Granted Dec 9, 2008·50 cites·10 claims
- 3497US7341614B2Filter and filter assemblyIBIDEN CO LTD·Filed 2006·Granted Mar 11, 2008·101 cites·18 claims
- 3597US7342803B2Printed circuit board and method of manufacturing printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Mar 11, 2008·92 cites·20 claims
- 3697US7119046B2Catalyst carrier and method of producing sameIBIDEN CO LTD·Filed 2005·Granted Oct 10, 2006·44 cites·32 claims
- 3797US6591495B2Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic platingIBIDEN CO LTD·Filed 2001·Granted Jul 15, 2003·102 cites·5 claims
- 3897US6507006B1Ceramic substrate and process for producing the sameIBIDEN CO LTD·Filed 2000·Granted Jan 14, 2003·137 cites·18 claims
- 3997US6465763B1Ceramic heaterIBIDEN CO LTD·Filed 2000·Granted Oct 15, 2002·112 cites·10 claims
- 4097US6376052B1Multilayer printed wiring board and its production process, resin composition for filling through-holeIBIDEN CO LTD·Filed 2000·Granted Apr 23, 2002·117 cites·55 claims
- 4197US6217987B1Solder resist composition and printed circuit boardsIBIDEN CO LTD·Filed 1997·Granted Apr 17, 2001·160 cites·33 claims
- 4297USD319629SSemiconductor substrate with conducting patternIBIDEN CO LTD·Filed 1988·Granted Sep 3, 1991·95 cites·1 claims
- 4396US11187130B2Honeycomb structured bodyIBIDEN CO LTD·Filed 2020·Granted Nov 30, 2021·4 cites·7 claims
- 4496US7855894B2Printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Dec 21, 2010·26 cites·12 claims
- 4596US7834273B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Nov 16, 2010·41 cites·41 claims
- 4696US7777328B2Substrate and multilayer circuit boardIBIDEN CO LTD·Filed 2008·Granted Aug 17, 2010·50 cites·6 claims
- 4796US7504719B2Printed wiring board having a roughened surface formed on a metal layer, and method for producing the sameIBIDEN CO LTD·Filed 2005·Granted Mar 17, 2009·33 cites·16 claims
- 4896US7498544B2Firing furnace and method for manufacturing porous ceramic fired object with firing furnaceIBIDEN CO LTD·Filed 2005·Granted Mar 3, 2009·47 cites·29 claims
- 4996US7438967B2Ceramic honeycomb structural bodyIBIDEN CO LTD·Filed 2006·Granted Oct 21, 2008·75 cites·15 claims
- 5096US7178234B2Method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2005·Granted Feb 20, 2007·44 cites·7 claims
Showing the top 50 of 1,607 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →