Assignee
ICP TECH CO LTD
TW·4 granted patents·2 pending applications·2 citations·filing 2018–2023
Top patents by PatentIndex Score
6 records- 0174US10743411B1Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the componentICP TECH CO LTD·Filed 2020·Granted Aug 11, 2020·1 cites·8 claims
- 0263US11043911B2Motor control device with built-in current sensing resistor and power transistorICP TECH CO LTD·Filed 2019·Granted Jun 22, 2021·1 cites·8 claims
- 0353US12463188B2Flip-chip packaged power transistor module having built-in gate driverICP TECH CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·7 claims
- 0453US2025132233A1Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissipation Ceramic Substrates and Manufacturing method of the SameICP TECH CO LTD·Filed 2023·Application pending·0 cites
- 0547US2024114614A1Thermal Conduction - Electrical Conduction Isolated Circuit Board with Ceramic Substrate and Power Transistor EmbeddedICP TECH CO LTD·Filed 2022·Application pending·0 cites
- 0640US10524349B2Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the boardICP TECH CO LTD·Filed 2018·Granted Dec 31, 2019·0 cites·7 claims
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