Assignee
IDE EIICHI
JP·4 granted patents·2 pending applications·45 citations·filing 2007–2013
Top patents by PatentIndex Score
6 records- 0191US8952525B2Semiconductor module and method for manufacturing semiconductor moduleIDE EIICHI·Filed 2011·Granted Feb 10, 2015·23 cites·8 claims
- 0290US9439332B2Power moduleIDE EIICHI·Filed 2012·Granted Sep 6, 2016·15 cites·13 claims
- 0383US8400777B2Electronic member, electronic part and manufacturing method thereforIDE EIICHI·Filed 2010·Granted Mar 19, 2013·6 cites·6 claims
- 0459US8847374B2Power semiconductor module and manufacturing method thereofIDE EIICHI·Filed 2011·Granted Sep 30, 2014·1 cites·3 claims
- 0549US2008160183A1Conductive sintered layer forming composition and conductive coating film forming method and bonding method using the sameIDE EIICHI·Filed 2007·Application pending·0 cites
- 0648US2013119322A1Conductive sintered layer forming compositionIDE EIICHI·Filed 2013·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →