Assignee
IKEDA TOMOYUKI
JP·6 granted patents·30 citations·filing 2007–2012
Top patents by PatentIndex Score
6 records- 0186US8242379B2Multilayered printed wiring board with a multilayered core substrateIKEDA TOMOYUKI·Filed 2007·Granted Aug 14, 2012·18 cites·18 claims
- 0285US8101865B2Printed wiring board and a method of production thereofIKEDA TOMOYUKI·Filed 2009·Granted Jan 24, 2012·8 cites·20 claims
- 0377US9029711B2Method for manufacturing a printed wiring board having a through-hole conductorIKEDA TOMOYUKI·Filed 2011·Granted May 12, 2015·2 cites·20 claims
- 0465US8966750B2Method of manufacturing a multilayered printed wiring boardIKEDA TOMOYUKI·Filed 2011·Granted Mar 3, 2015·1 cites·17 claims
- 0564US8324506B2Printed wiring board and a method of production thereofIKEDA TOMOYUKI·Filed 2009·Granted Dec 4, 2012·1 cites·20 claims
- 0657US8890000B2Printed wiring board having through-hole and a method of production thereofIKEDA TOMOYUKI·Filed 2012·Granted Nov 18, 2014·0 cites·20 claims
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