Assignee
IKEZAWA RYOICHI
0 granted patents·4 pending applications·0 citations·filing 2003–2006
Top patents by PatentIndex Score
4 records- 0137US2009062430A1Epoxy Resin Composition for Sealing and Electronic Component DeviceIKEZAWA RYOICHI·Filed 2006·Application pending·0 cites
- 0236US2005222300A1Encapsulating epoxy resin composition, and electronic parts device using the sameIKEZAWA RYOICHI·Filed 2003·Application pending·0 cites
- 0336US2009137717A1Encapsulated epoxy resin composition and electronic component deviceIKEZAWA RYOICHI·Filed 2006·Application pending·0 cites
- 0435US2006014873A1Encapsulating epoxy resin composition, and electronic parts device using the sameIKEZAWA RYOICHI·Filed 2003·Application pending·0 cites
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