Assignee
IMAI HIDEO
JP·2 granted patents·1 pending application·3 citations·filing 2005–2012
Top patents by PatentIndex Score
3 records- 0164US8174110B2Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuitIMAI HIDEO·Filed 2008·Granted May 8, 2012·2 cites·5 claims
- 0259US9000575B2Semiconductor device having stacked substrates with protruding and recessed electrode connectionIMAI HIDEO·Filed 2012·Granted Apr 7, 2015·1 cites·14 claims
- 0341US2005212130A1Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipmentIMAI HIDEO·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →