Assignee

IMAI TETSUO

JP·1 granted patent·7 citations·filing 2008–2008

Technology mixB22F1 C22C1 C23C1 C25D1 H10W1 Y10T1

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0169US8309164B2Metallized substrate and method for producing the sameIMAI TETSUO·Filed 2008·Granted Nov 13, 2012·7 cites·5 claims

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