Assignee
INDIANA INTEGRATED CIRCUITS LLC
US·16 granted patents·2 pending applications·32 citations·filing 2014–2023
Top patents by PatentIndex Score
18 records- 0191US9620473B1Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignmentINDIANA INTEGRATED CIRCUITS LLC·Filed 2014·Granted Apr 11, 2017·18 cites·9 claims
- 0289US10409004B2Method and system to passively align and attach fiber array to laser array or optical waveguide arrayINDIANA INTEGRATED CIRCUITS LLC·Filed 2017·Granted Sep 10, 2019·8 cites·15 claims
- 0387US10598861B2Method and system to passively align and attach fiber array to laser array or optical waveguide arrayINDIANA INTEGRATED CIRCUITS LLC·Filed 2019·Granted Mar 24, 2020·5 cites·4 claims
- 0470US11523511B2Assembling and handling edge interconnect packaging systemINDIANA INTEGRATED CIRCUITS LLC·Filed 2021·Granted Dec 6, 2022·0 cites·3 claims
- 0567US9806030B2Prototyping of electronic circuits with edge interconnectsINDIANA INTEGRATED CIRCUITS LLC·Filed 2016·Granted Oct 31, 2017·1 cites·13 claims
- 0660US11398463B2Edge interconnect self-assembly substrateINDIANA INTEGRATED CIRCUITS LLC·Filed 2020·Granted Jul 26, 2022·0 cites·3 claims
- 0757US10945335B2Assembling and handling edge interconnect packaging systemINDIANA INTEGRATED CIRCUITS LLC·Filed 2017·Granted Mar 9, 2021·0 cites·2 claims
- 0853US10056335B2Prototyping of electronic circuits with edge interconnectsINDIANA INTEGRATED CIRCUITS LLC·Filed 2017·Granted Aug 21, 2018·0 cites·7 claims
- 0953US9844139B2Method of interconnecting microchipsINDIANA INTEGRATED CIRCUITS LLC·Filed 2014·Granted Dec 12, 2017·0 cites·5 claims
- 1048US10896898B2Edge interconnect self-assembly substrateINDIANA INTEGRATED CIRCUITS LLC·Filed 2016·Granted Jan 19, 2021·0 cites·13 claims
- 1148US10050027B2Quilt packaging system with mated metal interconnect nodules and voidsINDIANA INTEGRATED CIRCUITS LLC·Filed 2017·Granted Aug 14, 2018·0 cites·8 claims
- 1245US2022322532A1Three-Dimensional Printed Circuit Substrate AssemblyINDIANA INTEGRATED CIRCUITS LLC·Filed 2022·Application pending·0 cites
- 1343US11658432B2Edge interconnects for use with circuit boards and integrated circuitsINDIANA INTEGRATED CIRCUITS LLC·Filed 2021·Granted May 23, 2023·0 cites·13 claims
- 1441US2026012161A1Energy Recovery Adiabatic Flip-Flop and Resonator Based Bennett Clock GeneratorINDIANA INTEGRATED CIRCUITS LLC·Filed 2023·Application pending·0 cites
- 1539US11224126B2Edge interconnects for use with circuit boards and integrated circuitsINDIANA INTEGRATED CIRCUITS LLC·Filed 2020·Granted Jan 11, 2022·0 cites·15 claims
- 1638US11488660B2Adiabatic flip-flop and memory cell designINDIANA INTEGRATED CIRCUITS LLC·Filed 2021·Granted Nov 1, 2022·0 cites·2 claims
- 1737US10182498B2Substrates with interdigitated hinged edge interconnectsINDIANA INTEGRATED CIRCUITS LLC·Filed 2016·Granted Jan 15, 2019·0 cites·9 claims
- 1834US10325875B2Edge interconnect packaging of integrated circuits for power systemsINDIANA INTEGRATED CIRCUITS LLC·Filed 2015·Granted Jun 18, 2019·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →