Assignee
INOPLA INC
US·5 granted patents·23 citations·filing 2004–2007
Top patents by PatentIndex Score
5 records- 0181US7364496B2Polishing head for polishing semiconductor wafersINOPLA INC·Filed 2007·Granted Apr 29, 2008·11 cites·26 claims
- 0263US7238614B2Methods for fabricating one or more metal damascene structures in a semiconductor waferINOPLA INC·Filed 2005·Granted Jul 3, 2007·1 cites·9 claims
- 0361US7367866B2Apparatus and method for polishing semiconductor wafers using pivotable load/unload cupsINOPLA INC·Filed 2005·Granted May 6, 2008·1 cites·19 claims
- 0460US7223153B2Apparatus and method for polishing semiconductor wafers using one or more polishing surfacesINOPLA INC·Filed 2004·Granted May 29, 2007·5 cites·20 claims
- 0557US7374471B2Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cupsINOPLA INC·Filed 2004·Granted May 20, 2008·5 cites·37 claims
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