Assignee
INT PACKAGING AND ASSEMBLY COR
US·2 granted patents·84 citations·filing 1996–1997
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0178US5872395ABent tip method for preventing vertical motion of heat spreaders during injection molding of IC packagesINT PACKAGING AND ASSEMBLY COR·Filed 1996·Granted Feb 16, 1999·71 cites·8 claims
- 0243US5859477AApparatus for encapsulating IC packages with diamond substrate thermal conductorINT PACKAGING AND ASSEMBLY COR·Filed 1997·Granted Jan 12, 1999·13 cites·9 claims
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