Assignee
INTEGRATED CIRCUIT SOLUTION INC
TW·3 granted patents·1 pending application·5 citations·filing 2008–2014
Top patents by PatentIndex Score
4 records- 0160US7863759B2Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapseINTEGRATED CIRCUIT SOLUTION INC·Filed 2008·Granted Jan 4, 2011·2 cites·5 claims
- 0255US9018934B2Low voltage bandgap reference circuitINTEGRATED CIRCUIT SOLUTION INC·Filed 2013·Granted Apr 28, 2015·2 cites·10 claims
- 0351US9153344B1Device for detecting defective global word lineINTEGRATED CIRCUIT SOLUTION INC·Filed 2014·Granted Oct 6, 2015·1 cites·6 claims
- 0437US2014337547A1High speed data transmission structureINTEGRATED CIRCUIT SOLUTION INC·Filed 2013·Application pending·0 cites
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