Assignee
INVENSAS BONDING TECH INC
US·76 granted patents·13 pending applications·5,967 citations·filing 2014–2022
Top patents by PatentIndex Score
89 records- 0199US11476213B2Bonded structures without intervening adhesiveINVENSAS BONDING TECH INC·Filed 2020·Granted Oct 18, 2022·50 cites·22 claims
- 0299US11462419B2Microelectronic assembliesINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 4, 2022·52 cites·19 claims
- 0399US11276676B2Stacked devices and methods of fabricationINVENSAS BONDING TECH INC·Filed 2019·Granted Mar 15, 2022·156 cites·15 claims
- 0499US11256004B2Direct-bonded lamination for improved image clarity in optical devicesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 22, 2022·157 cites·19 claims
- 0599US11244920B2Method and structures for low temperature device bondingINVENSAS BONDING TECH INC·Filed 2019·Granted Feb 8, 2022·78 cites·13 claims
- 0699US11056348B2Bonding surfaces for microelectronicsINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 6, 2021·154 cites·14 claims
- 0799US10985133B2Die processingINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 20, 2021·144 cites·18 claims
- 0899US10434749B2Method of room temperature covalent bondingINVENSAS BONDING TECH INC·Filed 2014·Granted Oct 8, 2019·60 cites·16 claims
- 0999US10269756B2Die processingINVENSAS BONDING TECH INC·Filed 2018·Granted Apr 23, 2019·216 cites·19 claims
- 1099US10204893B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Feb 12, 2019·203 cites·30 claims
- 1199US10147641B23D IC method and deviceINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 4, 2018·47 cites·24 claims
- 1299US9953941B2Conductive barrier direct hybrid bondingINVENSAS BONDING TECH INC·Filed 2015·Granted Apr 24, 2018·251 cites·15 claims
- 1398US11393779B2Large metal pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 19, 2022·58 cites·15 claims
- 1498US11385278B2Security circuitry for bonded structuresINVENSAS BONDING TECH INC·Filed 2020·Granted Jul 12, 2022·60 cites·27 claims
- 1598US11380597B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted Jul 5, 2022·57 cites·19 claims
- 1698US11373963B2Protective elements for bonded structuresINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 28, 2022·52 cites·27 claims
- 1798US11367652B2Microelectronic assembly from processed substrateINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 21, 2022·62 cites·29 claims
- 1898US11355404B2Mitigating surface damage of probe pads in preparation for direct bonding of a substrateINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 7, 2022·50 cites·22 claims
- 1998US11348801B2Processing stacked substratesINVENSAS BONDING TECH INC·Filed 2020·Granted May 31, 2022·7 cites·20 claims
- 2098US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 2198US11296044B2Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processesINVENSAS BONDING TECH INC·Filed 2019·Granted Apr 5, 2022·80 cites·24 claims
- 2298US11205625B2Wafer-level bonding of obstructive elementsINVENSAS BONDING TECH INC·Filed 2020·Granted Dec 21, 2021·68 cites·28 claims
- 2398US11169326B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsINVENSAS BONDING TECH INC·Filed 2019·Granted Nov 9, 2021·60 cites·22 claims
- 2498US11171117B2Interlayer connection of stacked microelectronic componentsINVENSAS BONDING TECH INC·Filed 2019·Granted Nov 9, 2021·155 cites·14 claims
- 2598US11158606B2Molded direct bonded and interconnected stackINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·159 cites·35 claims
- 2698US11158573B2Interconnect structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·67 cites·26 claims
- 2798US11088099B2Multi-metal contact structure in microelectronic componentINVENSAS BONDING TECH INC·Filed 2019·Granted Aug 10, 2021·155 cites·21 claims
- 2898US11037919B2Techniques for processing devicesINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 15, 2021·88 cites·29 claims
- 2998US11031285B2Diffusion barrier collar for interconnectsINVENSAS BONDING TECH INC·Filed 2018·Granted Jun 8, 2021·159 cites·23 claims
- 3098US11011503B2Direct-bonded optoelectronic interconnect for high-density integrated photonicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·148 cites·17 claims
- 3198US11011494B2Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·133 cites·36 claims
- 3298US11004757B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2018·Granted May 11, 2021·117 cites·20 claims
- 3398US10923408B2Cavity packagesINVENSAS BONDING TECH INC·Filed 2018·Granted Feb 16, 2021·133 cites·17 claims
- 3498US10879226B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·21 cites·24 claims
- 3598US10879212B2Processed stacked diesINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 29, 2020·155 cites·21 claims
- 3698US10840205B2Chemical mechanical polishing for hybrid bondingINVENSAS BONDING TECH INC·Filed 2018·Granted Nov 17, 2020·146 cites·28 claims
- 3798US10790262B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Sep 29, 2020·160 cites·13 claims
- 3898US10784191B2Interface structures and methods for forming sameINVENSAS BONDING TECH INC·Filed 2018·Granted Sep 22, 2020·123 cites·24 claims
- 3998US10727219B2Techniques for processing devicesINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 28, 2020·90 cites·22 claims
- 4098US10707087B2Processing stacked substratesINVENSAS BONDING TECH INC·Filed 2017·Granted Jul 7, 2020·154 cites·21 claims
- 4198US10522499B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 31, 2019·137 cites·28 claims
- 4298US10515913B2Multi-metal contact structureINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 24, 2019·24 cites·15 claims
- 4398US10508030B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 17, 2019·124 cites·14 claims
- 4498US10446532B2Systems and methods for efficient transfer of semiconductor elementsINVENSAS BONDING TECH INC·Filed 2016·Granted Oct 15, 2019·161 cites·23 claims
- 4598US10446487B2Interface structures and methods for forming sameINVENSAS BONDING TECH INC·Filed 2017·Granted Oct 15, 2019·151 cites·28 claims
- 4698US10269708B2Increased contact alignment tolerance for direct bondingINVENSAS BONDING TECH INC·Filed 2017·Granted Apr 23, 2019·49 cites·20 claims
- 4798US10262963B2Conductive barrier direct hybrid bondingINVENSAS BONDING TECH INC·Filed 2018·Granted Apr 16, 2019·19 cites·14 claims
- 4898US10002844B1Bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Jun 19, 2018·167 cites·20 claims
- 4998US9852988B2Increased contact alignment tolerance for direct bondingINVENSAS BONDING TECH INC·Filed 2016·Granted Dec 26, 2017·218 cites·20 claims
- 5097US10998292B2Offset pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted May 4, 2021·155 cites·13 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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