Assignee
IRUVANTI SUSHUMNA
US·2 granted patents·13 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0184US8455998B2Method and package for circuit chip packagingIRUVANTI SUSHUMNA·Filed 2011·Granted Jun 4, 2013·8 cites·13 claims
- 0280US9045674B2High thermal conductance thermal interface materials based on nanostructured metallic network-polymer compositesIRUVANTI SUSHUMNA·Filed 2012·Granted Jun 2, 2015·5 cites·19 claims
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