Assignee
IRVINE SENSORS CORP
US·87 granted patents·27 pending applications·7,187 citations·filing 1977–2019
Top patents by PatentIndex Score
114 records- 0198US4525921AHigh-density electronic processing package-structure and fabricationIRVINE SENSORS CORP·Filed 1983·Granted Jul 2, 1985·263 cites·7 claims
- 0297US4983533AHigh-density electronic modules - process and productIRVINE SENSORS CORP·Filed 1987·Granted Jan 8, 1991·378 cites·11 claims
- 0397US4706166AHigh-density electronic modules--process and productIRVINE SENSORS CORP·Filed 1986·Granted Nov 10, 1987·337 cites·17 claims
- 0497US4646128AHigh-density electronic processing package--structure and fabricationIRVINE SENSORS CORP·Filed 1985·Granted Feb 24, 1987·225 cites·14 claims
- 0596US7436494B1Three-dimensional ladar module with alignment reference insert circuitryIRVINE SENSORS CORP·Filed 2007·Granted Oct 14, 2008·115 cites·8 claims
- 0696US7335576B2Method for precision integrated circuit die singulation using differential etch ratesIRVINE SENSORS CORP·Filed 2005·Granted Feb 26, 2008·61 cites·14 claims
- 0796US5432729AElectronic module comprising a stack of IC chips each interacting with an IC chip secured to the stackIRVINE SENSORS CORP·Filed 1994·Granted Jul 11, 1995·453 cites·29 claims
- 0896US5104820AMethod of fabricating electronic circuitry unit containing stacked IC layers having lead reroutingIRVINE SENSORS CORP·Filed 1991·Granted Apr 14, 1992·410 cites·13 claims
- 0996US4764846AHigh density electronic package comprising stacked sub-modulesIRVINE SENSORS CORP·Filed 1987·Granted Aug 16, 1988·287 cites·18 claims
- 1095US6014316AIC stack utilizing BGA contactsIRVINE SENSORS CORP·Filed 1998·Granted Jan 11, 2000·237 cites·12 claims
- 1195US5581498AStack of IC chips in lieu of single IC chipIRVINE SENSORS CORP·Filed 1994·Granted Dec 3, 1996·438 cites·23 claims
- 1294US6028352AIC stack utilizing secondary leadframesIRVINE SENSORS CORP·Filed 1998·Granted Feb 22, 2000·227 cites·9 claims
- 1394US5347428AModule comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chipIRVINE SENSORS CORP·Filed 1992·Granted Sep 13, 1994·406 cites·26 claims
- 1494US4551629ADetector array module-structure and fabricationIRVINE SENSORS CORP·Filed 1984·Granted Nov 5, 1985·107 cites·8 claims
- 1593US5701233AStackable modules and multimodular assembliesIRVINE SENSORS CORP·Filed 1995·Granted Dec 23, 1997·259 cites·24 claims
- 1693US4617160AMethod for fabricating modules comprising uniformly stacked, aligned circuit-carrying layersIRVINE SENSORS CORP·Filed 1984·Granted Oct 14, 1986·136 cites·14 claims
- 1792US7235785B2Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane arrayIRVINE SENSORS CORP·Filed 2005·Granted Jun 26, 2007·144 cites·11 claims
- 1892US7127807B2Process of manufacturing multilayer modulesIRVINE SENSORS CORP·Filed 2003·Granted Oct 31, 2006·69 cites·5 claims
- 1992US6829237B2High speed multi-stage switching network formed from stacked switching layersIRVINE SENSORS CORP·Filed 2001·Granted Dec 7, 2004·93 cites·19 claims
- 2092US5955668AMulti-element micro gyroIRVINE SENSORS CORP·Filed 1998·Granted Sep 21, 1999·242 cites·20 claims
- 2191US6784547B2Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layersIRVINE SENSORS CORP·Filed 2002·Granted Aug 31, 2004·46 cites·16 claims
- 2291US6117704AStackable layers containing encapsulated chipsIRVINE SENSORS CORP·Filed 1999·Granted Sep 12, 2000·137 cites·15 claims
- 2391US5953588AStackable layers containing encapsulated IC chipsIRVINE SENSORS CORP·Filed 1996·Granted Sep 14, 1999·128 cites·14 claims
- 2491US5406701AFabrication of dense parallel solder bump connectionsIRVINE SENSORS CORP·Filed 1993·Granted Apr 18, 1995·76 cites·25 claims
- 2590US6806559B2Method and apparatus for connecting vertically stacked integrated circuit chipsIRVINE SENSORS CORP·Filed 2002·Granted Oct 19, 2004·63 cites·40 claims
- 2690US6706971B2Stackable microcircuit layer formed from a plastic encapsulated microcircuitIRVINE SENSORS CORP·Filed 2002·Granted Mar 16, 2004·70 cites·6 claims
- 2790US6072234AStack of equal layer neo-chips containing encapsulated IC chips of different sizesIRVINE SENSORS CORP·Filed 1999·Granted Jun 6, 2000·105 cites·33 claims
- 2889US4675532ACombined staring and scanning photodetector sensing system having both temporal and spatial filteringIRVINE SENSORS CORP·Filed 1985·Granted Jun 23, 1987·67 cites·26 claims
- 2988US6560109B2Stack of multilayer modules with heat-focusing metal layerIRVINE SENSORS CORP·Filed 2001·Granted May 6, 2003·44 cites·10 claims
- 3087US5424920ANon-conductive end layer for integrated stack of IC chipsIRVINE SENSORS CORP·Filed 1994·Granted Jun 13, 1995·147 cites·20 claims
- 3187US4672737ADetector array module fabrication processIRVINE SENSORS CORP·Filed 1985·Granted Jun 16, 1987·83 cites·15 claims
- 3286US10502949B2Multi-polygon laser scanner comprising pyramidal timing polygonIRVINE SENSORS CORP·Filed 2018·Granted Dec 10, 2019·5 cites·1 claims
- 3386US6650704B1Method of producing a high quality, high resolution image from a sequence of low quality, low resolution images that are undersampled and subject to jitterIRVINE SENSORS CORP·Filed 1999·Granted Nov 18, 2003·138 cites·13 claims
- 3486US5279991AMethod for fabricating stacks of IC chips by segmenting a larger stackIRVINE SENSORS CORP·Filed 1992·Granted Jan 18, 1994·91 cites·24 claims
- 3586US4555623APre-amplifier in focal plane detector arrayIRVINE SENSORS CORP·Filed 1983·Granted Nov 26, 1985·35 cites·11 claims
- 3685US4806761AThermal imager incorporating electronics module having focal plane sensor mosaicIRVINE SENSORS CORP·Filed 1987·Granted Feb 21, 1989·52 cites·2 claims
- 3784US9810776B2LIDAR scanner apparatusIRVINE SENSORS CORP·Filed 2014·Granted Nov 7, 2017·10 cites·3 claims
- 3884US7242082B2Stackable layer containing ball grid array packageIRVINE SENSORS CORP·Filed 2005·Granted Jul 10, 2007·12 cites·4 claims
- 3983US6734370B2Multilayer modules with flexible substratesIRVINE SENSORS CORP·Filed 2001·Granted May 11, 2004·32 cites·13 claims
- 4083US5508836AInfrared wireless communication between electronic system componentsIRVINE SENSORS CORP·Filed 1994·Granted Apr 16, 1996·85 cites·12 claims
- 4182US7265579B2Field programmable gate array incorporating dedicated memory stacksIRVINE SENSORS CORP·Filed 2005·Granted Sep 4, 2007·10 cites·4 claims
- 4281US6389404B1Neural processing module with input architectures that make maximal use of a weighted synapse arrayIRVINE SENSORS CORP·Filed 1998·Granted May 14, 2002·80 cites·17 claims
- 4381US5235672AHardware for electronic neural networkIRVINE SENSORS CORP·Filed 1991·Granted Aug 10, 1993·53 cites·14 claims
- 4480US7082591B2Method for effectively embedding various integrated circuits within field programmable gate arraysIRVINE SENSORS CORP·Filed 2003·Granted Jul 25, 2006·31 cites·35 claims
- 4580US6717061B2Stacking of multilayer modulesIRVINE SENSORS CORP·Filed 2001·Granted Apr 6, 2004·30 cites·3 claims
- 4680US4912545ABonding of aligned conductive bumps on adjacent surfacesIRVINE SENSORS CORP·Filed 1987·Granted Mar 27, 1990·60 cites·14 claims
- 4779US10353074B2Agile navigation and guidance enabled by LIDAR (ANGEL)IRVINE SENSORS CORP·Filed 2017·Granted Jul 16, 2019·4 cites·6 claims
- 4879US7198965B2Method for making a neo-layer comprising embedded discrete componentsIRVINE SENSORS CORP·Filed 2006·Granted Apr 3, 2007·10 cites·16 claims
- 4978US6476392B1Method and apparatus for temperature compensation of an uncooled focal plane arrayIRVINE SENSORS CORP·Filed 2001·Granted Nov 5, 2002·22 cites·23 claims
- 5077US10078791B2Methods and devices for cognitive-based image data analytics in real timeIRVINE SENSORS CORP·Filed 2015·Granted Sep 18, 2018·7 cites·10 claims
Showing the top 50 of 114 patent records by PatentIndex Score.
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