Assignee
ISHIHARA CHEMICAL CO LTD
JP·19 granted patents·5 pending applications·205 citations·filing 1987–2021
Top patents by PatentIndex Score
24 records- 0196US7628903B1Silver and silver alloy plating bathISHIHARA CHEMICAL CO LTD·Filed 2000·Granted Dec 8, 2009·70 cites·3 claims
- 0290US7938948B2Silver and silver alloy plating bathISHIHARA CHEMICAL CO LTD·Filed 2009·Granted May 10, 2011·6 cites·10 claims
- 0388US4804410APalladium-base electroless plating solutionISHIHARA CHEMICAL CO LTD·Filed 1987·Granted Feb 14, 1989·76 cites·14 claims
- 0462US9905339B2Conductive film forming method and sintering promoterISHIHARA CHEMICAL CO LTD·Filed 2013·Granted Feb 27, 2018·1 cites·5 claims
- 0562US6544398B2Non-cyanide-type gold-tin alloy plating bathISHIHARA CHEMICAL CO LTD·Filed 2001·Granted Apr 8, 2003·4 cites·5 claims
- 0661US5340658AComposites made of carbon-based and metallic materialsISHIHARA CHEMICAL CO LTD·Filed 1992·Granted Aug 23, 1994·22 cites·3 claims
- 0759US12388035B2Structure comprising under barrier metal and solder layer, and method for producing structureISHIHARA CHEMICAL CO LTD·Filed 2021·Granted Aug 12, 2025·0 cites·4 claims
- 0858US12448690B2Treatment method after plating with Sn or Sn alloyISHIHARA CHEMICAL CO LTD·Filed 2021·Granted Oct 21, 2025·0 cites·7 claims
- 0958US5378271ATire polishing and protective compositionISHIHARA CHEMICAL CO LTD·Filed 1993·Granted Jan 3, 1995·23 cites·6 claims
- 1053US11946153B2Copper or copper alloy electroplating bathISHIHARA CHEMICAL CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·13 claims
- 1152US10329644B2Ta—Nb alloy powder and anode element for solid electrolytic capacitorISHIHARA CHEMICAL CO LTD·Filed 2014·Granted Jun 25, 2019·0 cites·17 claims
- 1249US6730240B2Colored, transparent film-forming composition, its coating method and removing method of a film thereofISHIHARA CHEMICAL CO LTD·Filed 2001·Granted May 4, 2004·2 cites·7 claims
- 1347US11993862B2Structure including copper plating layer or copper alloy plating layerISHIHARA CHEMICAL CO LTD·Filed 2020·Granted May 28, 2024·0 cites·7 claims
- 1446US2015030784A1Conductive film forming method and sintering promoterISHIHARA CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1544US11052637B2Structure containing Sn layer or Sn alloy layerISHIHARA CHEMICAL CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·1 claims
- 1644US2016029483A1Copper particulate dispersion, conductive film forming method, and circuit boardISHIHARA CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1744US2016007455A1Copper particulate dispersion, conductive film forming method, and circuit boardISHIHARA CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1843US2015021071A1Circuit board, conductive film forming method and adhesiveness improverISHIHARA CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 1940US12519071B2Structure containing Sn layer or Sn alloy layerISHIHARA CHEMICAL CO LTD·Filed 2020·Granted Jan 6, 2026·0 cites·5 claims
- 2040US2016104580A1Ta powder, production method therefor, and ta granulated powderISHIHARA CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 2128US10062657B2Method for manufacturing alloy bumpISHIHARA CHEMICAL CO LTD·Filed 2015·Granted Aug 28, 2018·0 cites·3 claims
- 2227US11939691B2Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bathISHIHARA CHEMICAL CO LTD·Filed 2017·Granted Mar 26, 2024·0 cites·4 claims
- 2327US7799112B2Production method of pure metal/alloy super-micro powderISHIHARA CHEMICAL CO LTD·Filed 2003·Granted Sep 21, 2010·0 cites·9 claims
- 2426US5120917AComposition for preventing formation of scales in weldingISHIHARA CHEMICAL CO LTD·Filed 1991·Granted Jun 9, 1992·1 cites·2 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →